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Senior Staff Design Engineer

Hsin Chu, Taiwan, Taiwan
Nov 23, 2021


Job Description


At Xilinx, we are leading the industry transformation to build an adaptable, intelligent world. ARE YOU bold, collaborative, and creative? We develop leaders and innovators who want to revolutionize the world of technology. We believe that by embracing diverse ideas, pushing boundaries, and working together as ONEXILINX, anything is possible.

Our culture of innovation began with the invention of the Field Programmable Gate Array (FPGA), and with the 2018 introduction of our Adaptive Compute Acceleration Platform (ACAP), has made a quantum leap in capability, solidifying our role as the adaptable platform supplier of choice. From the beginning, we have always believed in providing inventors with products and platforms that are infinitely adaptable. From self-driving cars, to world-record genome processing, to AI and big data, to the world's first 5G networks, we empower the world's builders and visionaries whose ideas solve every day problems and improve people's lives.

If you are PASSIONATE, ADAPTABLE, and INNOVATIVE, Xilinx is the right place for you! At Xilinx, we care deeply about creating significant development experiences while building a strong sense of belonging and connection. We champion an environment of empowered learning, wellness, community engagement, and recognition, so you can focus on work that matters - world class technology that improves the way we live and work. We are ONEXILINX.

Job Descriptions:

Oversee definition, design, verification, and documentation for Xilinx FPGA development and package

design architecture and matrix definition. Determines architecture design, logic design, and system

simulation. Package design architect responsible for the new product family and package matrix definition, performance and cost tradeoff assessment, technology and design rule development, package structure planning. Drive integration, verification, and characterization in advanced FPGA systems, incorporating silicon/TSV, package stack-up/routing/PDN, discrete decoupling capacitors, and system board interfaces. Utilize techniques in EM (Electromagnetic) and Circuit model generation, simulation, and validation for correlating hardware measurements versus pre/post-layout simulation, effecting signal integrity-driven design flow for advanced FPGA product development. Optimize system-level performance in power integrity, high-speed IO/SSO, and multi-tens gigabit transceivers. Drive cost reduction through the adoption of leading-edge package technology while achieving performance-driven objectives. Technical lead in Xilinx package development department.



•            Possesses an understanding of high-speed serdes, memory interface, supply voltage noise, and packaging technologies/trends to drive package design validation throughout all phases of the product cycle

•            Understand in-depth package development flow and work fluently with NPI program management and manufacturing/process team to synthesize a cohesive package introduction plan

•            Interface and negotiate effectively across engineering teams to balance performance adequacy and schedule commitment

•            Drive package design review, manage modeling/simulation projects, prepare and present the final design review (FDR) to all product partners

•            Collaborate with silicon IP, silicon evaluation, and package technology teams to establish the development plan and timeline for the R&D project, test vehicle, and prototype packages


Education Requirements

Years of Experience

BS with 12+ years or MS with 8+ years in Electrical Engineering or Computer Engineering or related equivalent.

Industry experience in IC package technology and product development in the semiconductor industry with consistent track record.

Demonstrate technical leadership in complex product development under challenging technical and schedule conditions

Refer to the Talent Network

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