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Perform failure analysis tasks on Xilinx products using common failure analysis tools (microscopy, chemical delayering, polishing, cross-sectioning, SEM, dualbeam FIB/SEM, TEM, EBIC/EBAC, micro- and nano-probing etc)
Develop and establish new FA methodologies, support FA development for new Xilinx products and technologies
Evaluate and qualify new FA laboratory tools and equipment
Maintain existing FA laboratory tools and equipment
Generates and contributes to failure analysis reports, 8D reports, failure analysis procedures
Acts as FA representative to internal and external customers on cross functional projects
Perform required duties as part of emergency response team for FA lab
Manage interactions with FA functions of Xilinx manufacturing partners
Bachelor’s or Master’s Degree in Electrical Engineering, Material Science, Physics or related discipline
Minimum 7 years of experience in semiconductor Failure Analysis role
Knowledge of semiconductor devices, device processing, device physics, basic chemistry and defect failure mechanisms
Skills in circuit analysis, FA techniques, deductive reasoning and problem solving
Experience in fault isolation for semiconductors (EMMI/OBIRCH)
Knowledge in assembly process of semiconductor components and board assembly process is advantageous