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Optical and IC Package Design Staff Engineer

Taichung, Taiwan, Taiwan
Aug 3, 2020


Job Description


At Xilinx, we are leading the industry transformation to build an adaptable, intelligent world. ARE YOU bold, collaborative, and creative? At Xilinx, we hire and develop leaders and innovators who want to revolutionize the world of technology. We believe that by embracing diverse ideas, pushing boundaries, and working together as ONEXILINX, anything is possible.

Our culture of innovation began with the invention of the Field Programmable Gate Array (FPGA), and with the 2018 introduction of our Adaptive Compute Acceleration Platform (ACAP), has made a quantum leap in capability, solidifying our role as the adaptable platform supplier of choice. From the start, we have always believed in providing inventors with products and platforms that are infinitely adaptable. From self-driving cars, to world-record genome processing, to AI and big data, to the world's first 5G networks, we empower the world's builders and visionaries whose ideas solve every day problems and enhance people's lives.

If you are PASSIONATE, ADAPTABLE, and INNOVATIVE, Xilinx is the right place for you! At Xilinx we care deeply about creating meaningful development experiences while building a strong sense of belonging and connection. We foster an environment of empowered learning, wellness, community engagement, and recognition, so you can focus on work that matters - world class technology that improves the way we live and work. We are ONEXILINX.

We Are Looking For Someone Who Demonstrates

- Strong communication, teamwork, and problem solving

- Excellent verbal and written communication skills

- A proven track record of working across organization boundaries to define requirements, solve complex problems and drive programs to successful completion.

- Intense collaboration, thoughtful, fast, disciplined execution

- Tenacious commitment to continuous improvement

- Relentless drive to win

Experience And Skills

• Design: Very strong experience in Opto-electronic package mechanical design (assembly, substrate, stiffener/heat spreader), single mode/multi-fiber breakout, strain relief, termination and connectorization design 

• Process: Single mode/multi-fiber alignment and attach, strain relief techniques and adhesives, Flip Chip Assembly.  Knowledge in Silicon Photonics package reliability is highly desired. 

•Vendor and Project Management: Work with 3rd party, foundry and OSAT to bring packaging solution from concept to HVM

•CAD: Strong experience with Creo Is required and it will be plus to have SolidWorks

•FEA: FEA experience using ANSYS is a plus

•Industrial experience: very strong experience in process development and mechanical design of Silicon Photonics packages or modules and productization

Manufacturing: Excellent knowledge of DFM (Design for Manufacturing), including experience with

volume manufacturing in Asia as well as North America.

•Lab Skills: Experience with Design of Experiments, instrumentation, data acquisition and analysis,

including uncertainty analysis. This is to cover:

Mechanical pressure measurement,

Mechanical warpage using Shadow Moire’, DIC

Knowledgeable with FIB, SEM, TMA, DMA, MTS, X-ray, C-SAM, T-SAM


Education Requirements

Ph.D. or M.S. in Opto-Mechanical Engineering or related field is required from a top tier university

Years of Experience

5-8 years of work experience in an Opto-electronics package mechanical design and process role with a recognized industry leader
Refer to the Talent Network