DescriptionAt Xilinx, we are leading the industry transformation to build an adaptable, intelligent world. ARE YOU bold, collaborative, and creative? At Xilinx, we hire and develop leaders and innovators who want to revolutionize the world of technology. We believe that by embracing diverse ideas, pushing boundaries, and working together as ONEXILINX, anything is possible.
In this key technical position, you will leverage your package design expertise and engage in the following undertakings.
Design advanced and heterogeneous integration packages to meet/exceed package and system electrical and thermal performances
Develop new package solutions including pin-out definitions, DRC/DFM and stack-up requirements
Implement chip-package design flow and LVS verification
Experience in CADENCE Allegro Package Designer, including constraints setup
Familiarity with AutoCAD, Gerber/ODB++/GDSII conversion software, and DFM tools
Knowledge in packaging substrate structures and manufacturing
Knowledge in 2.5D/3D, flipchip, WLP and wirebond assembly and reliability
Knowledge in SPICE, signal/power integrity, DDR3/4, and SerDes channel modeling for high speed design
Bachelors with 4+ years or Masters in EE or related fields
Years of Experience
A minimum of 2 years of relevant experience in advanced package design