At Xilinx, we are leading the industry transformation to build an adaptable, intelligent world. ARE YOU bold, collaborative, and creative? At Xilinx, we hire and develop leaders and innovators who want to revolutionize the world of technology. We believe that by embracing diverse ideas, pushing boundaries, and working together as ONEXILINX, anything is possible.
Our culture of innovation began with the invention of the Field Programmable Gate Array (FPGA), and with the 2018 introduction of our Adaptive Compute Acceleration Platform (ACAP), has made a quantum leap in capability, solidifying our role as the adaptable platform supplier of choice. From the start, we have always believed in providing inventors with products and platforms that are infinitely adaptable. From self-driving cars, to world-record genome processing, to AI and big data, to the world's first 5G networks, we empower the world's builders and visionaries whose ideas solve every day problems and enhance people's lives.
If you are PASSIONATE, ADAPTABLE, and INNOVATIVE, Xilinx is the right place for you! At Xilinx we care deeply about creating meaningful development experiences while building a strong sense of belonging and connection. We foster an environment of empowered learning, wellness, community engagement, and recognition, so you can focus on work that matters - world class technology that improves the way we live and work. We are ONEXILINX.
We Are Looking for Someone Who Demonstrates
Strong communication, teamwork, and problem solving:
Excellent verbal and written communication skills
A proven track record of working across organization boundaries to define requirements, solve complex problems and drive programs to successful completion.
Thoughtful, fast, disciplined execution
Tenacious commitment to continuous improvement
Relentless drive to win
Experience and Skills Requirements
•CAD: Very strong experience with SolidWorks and/or Creo is required.
•Manufacturing: Excellent knowledge of DFM (Design for Manufacturing), including experience with volume manufacturing in Asia as well as North America.
•FEA: FEA experience is required using ANSYS.
•Lab Skills: Experience with Design of Experiments, instrumentation, data acquisition and analysis, including uncertainty analysis. This is to cover Mechanical pressure measurement, Mechanical warpage, air flow measurement and thermal measurement
•Experience in the thermal and mechanical design for rack-mounted server equipment for the datacenter is a plus.
CFD: Experience with Icepak and/or Flotherm is a plus
Bachelor’s degree in Mechanical Engineering +5-7 years or a Master’s +3-5 years relevant experience in an electronics-cooling related Thermal/Mechanical Engineering role.