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Senior Staff Reliability Engineer

157332
San Jose, CA, United States
May 24, 2019

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Job Description

Description

Xilinx develops highly flexible and adaptive processing platforms that enable rapid innovation across a variety of technologies - from the endpoint to the edge to the cloud. Xilinx is the inventor of the FPGA, hardware programmable SoCs and the ACAP (Adaptive Compute Acceleration Platform), designed to deliver the most dynamic processor technology in the industry and enable the adaptable, intelligent and connected world of the future in a multitude of markets including Data Center (Compute, Storage and Networking); Wireless/5G and Wired Communications; Automotive/ADAS; Emulation & Prototyping; Aerospace & Defense; Industrial Scientific & Medical, and others. Xilinx's core strengths simultaneously address major industry trends including the explosion of data, heterogeneous computing after Moore's Law, and the dawn of artificial intelligence (AI).

Our global team is growing and we are looking for bold, collaborative and creative people to help us lead the industry transformation to build an adaptable intelligent world. We believe that by embracing diverse ideas, striving for excellence in all that we do, and working together as a unified team, we can accomplish anything. Come do your best work and live your best life as part of the ONEXILINX team!

 

As a member of the reliability engineering team, the Senior Staff Reliability Engineer's primary responsibility is to lead NPI reliability qualification including FPGA, programmable SoCs, and ACAP products.

Responsibilities:

  • Manage overall qualification scheduling and execution
  • Define reliability qualification requirements
  • Work with suppliers to design and verify reliability test hardware and burn-in patterns
  • Drive timely root cause investigation of qualification failures
  • Perform reliability data analysis to project product lifetime and assess reliability risk
  • Excellent teamwork and communication skills required to support NPI and customers

 

Qualifications:

  • BS in electrical engineering, physics, material science, or mechanical engineering (MS or PhD preferred)
  • 10+ years of experience in IC reliability engineering
  • 5+ years of experience in developing robust qualification plan for new products in advanced silicon and packaging technologies
  • 5+ years of experience in defining Burn-in board requirements for HTOL/THB/ESD/Latch-up tests
  • Excellent reliability and statistical data analysis skill to assess reliability risks and predict product lifetime
  • Knowledge of FinFET process, 2.5D/3D packaging process, MCC chambers, is highly preferred
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