DescriptionXilinx develops highly flexible and adaptive processing platforms that enable rapid innovation across a variety of technologies - from the endpoint to the edge to the cloud. Xilinx is the inventor of the FPGA, hardware programmable SoCs and the ACAP (Adaptive Compute Acceleration Platform), designed to deliver the most dynamic processor technology in the industry and enable the adaptable, intelligent and connected world of the future in a multitude of markets including Data Center (Compute, Storage and Networking); Wireless/5G and Wired Communications; Automotive/ADAS; Emulation & Prototyping; Aerospace & Defense; Industrial Scientific & Medical, and others. Xilinx's core strengths simultaneously address major industry trends including the explosion of data, heterogeneous computing after Moore's Law, and the dawn of artificial intelligence (AI).
We are looking for a talented, self-driven and motivated mechanical engineer to be part of a technology development team in Xilinx. This team develops cutting-edge technologies used in our products and its team members have ample opportunities to grow their technical knowledge and complex problem-solving skills.
In this position, this engineer will work in the thermo-mechanical product development and the introduction of the solution to the production. The candidate will need to have strong experience in understanding of the mechanical design and heat transfer of electronics equipment and packaging.
We Are Looking For Someone Who Demonstrates
· Strong communication, teamwork, and problem solving:
· Excellent verbal and written communication skills
· A proven track record of working across organization boundaries to define requirements, solve complex problems and drive programs to successful completion.
· Intense collaboration
· Thoughtful, fast, disciplined execution
· Tenacious commitment to continuous improvement
· Relentless drive to win
Experience And Skills
•CAD: Very strong experience with SolidWorks and/or Creo is required.
•FEA: very strong FEA experience is required using ANSYS to model static and dynamic Silicon package behavior in both components and system level.
•Manufacturing: Excellent knowledge of DFM (Design for Manufacturing), including experience with volume manufacturing in Asia as well as North America.
•Lab Skills: Experience with Design of Experiments, instrumentation, data acquisition and analysis, including uncertainty analysis. This is to cover:
Mechanical pressure measurement,
Mechanical warpage using Shadow Morrie’, DIC,
FIB, SEM, TMA, DMA, MTS, X-ray, C-SAM, T-SAM
Air flow measurement and thermal measurement
•Experience in the Reliability assessment of thermal and mechanical design, as, Silicon and packaging. CFD: Experience with Icepak and/or Flotherm is a plus.
Bachelor’s degree with five years relevant experience (or Masters with three years or PhD with zero plus years) in Mechanical Engineering in an electronics-cooling related Thermal/Mechanical Engineering role.