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IC Packaging Design and Integration Manager

156607
San Jose, CA, United States
Jun 21, 2019

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Job Description

Description

At Xilinx, we are leading the industry transformation to build an adaptable, intelligent world. ARE YOU bold, collaborative, and creative? At Xilinx, we hire and develop leaders and innovators who want to revolutionize the world of technology.  We believe that by embracing diverse ideas, pushing boundaries, and working together as ONEXILINX, anything is possible. 
Our culture of innovation began with the invention of the Field Programmable Gate Array (FPGA), and with the 2018 introduction of our Adaptive Compute Acceleration Platform (ACAP), has made a quantum leap in capability, solidifying our role as the adaptable platform supplier of choice.  From the start, we have always believed in providing inventors with products and platforms that are infinitely adaptable. From self-driving cars, to world-record genome processing, to AI and big data, to the world’s first 5G networks, we empower the world’s builders and visionaries whose ideas solve every day problems and enhance people’s lives.
If you are PASSIONATE, ADAPTABLE, and INNOVATIVE, Xilinx is the right place for you!  At Xilinx we care deeply about creating meaningful development experiences while building a strong sense of belonging and connection. We foster an environment of empowered learning, wellness, community engagement, and recognition, so you can focus on work that matters – world class technology that improves the way we live and work.  We are ONEXILINX.
 
Being part of the Xilinx Packaging Development department, you will lead an engineering team to assess and validate electrical performance for the new cutting-edge packaging technology and industry-leading ACAP products in the die/pkg/board co-design environment.  You will also manage the new product/package introduction by teaming up with internally the package architecture and design team and externally the silicon stakeholders, signal/power integrity, program management, and the operating organization.  This position requires both technical insight and skillful communication to develop the cross-functional synergy timely to resolve issues during the execution of new product development.

Job Responsibilities

  • Possesses an understanding of high-speed serdes, memory interface, supply voltage noise, and packaging technologies/trend to drive package design validation throughout all phases of product cycle
  • Understand in-depth package development flow and work fluently with NPI program management and manufacturing/process team to synthesize a cohesive package introduction plan
  • Interface and negotiate effectively across engineering teams to balance performance adequacy and schedule commitment
  • Drive package design review, manage modeling/simulation deliverables, prepare and present the final design review (FDR) to all product stakeholders
  • Collaborate with silicon IP, silicon evaluation and package technology teams to establish the development plan and timeline for the R&D project, test vehicle, and prototype packages

Job Requirement


Education Requirements

  • BS with 12+ years of experience or MS with 8+ years of experience or PhD with 5+ years of experience in Electrical Engineering or Computer Science or related equivalent
  • BS with 12+ years of experience or MS with 8+ years of experience or PhD with 5+ years of experience in Electrical Engineering or Computer Science or related equivalent

Years of Experience

  • Industry experience in IC package technology and product development in the semiconductor industry with proven records.
  • 5+ years project/program execution and engineering team management experience in the IC package development field
  • Demonstrate management experience in complex product development under challenging technical and schedule conditions
  • Demonstrate management experience in complex product development under challenging technical and schedule conditions

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