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Being part of the Xilinx Packaging Development department, you will lead an engineering team to assess and validate electrical performance for the new cutting-edge packaging technology and industry-leading ACAP products in the die/pkg/board co-design environment. You will also manage the new product/package introduction by teaming up with internally the package architecture and design team and externally the silicon stakeholders, signal/power integrity, program management, and the operating organization. This position requires both technical insight and skillful communication to develop the cross-functional synergy timely to resolve issues during the execution of new product development.
Years of Experience