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IC Substrate Engineer

Hsin Chu, Taiwan, Taiwan
Dec 5, 2018


Job Description


Xilinx develops highly flexible and adaptive processing platforms that enable rapid innovation across a variety of technologies - from the endpoint to the edge to the cloud. Xilinx is the inventor of the FPGA, hardware programmable SoCs and the ACAP (Adaptive Compute Acceleration Platform), designed to deliver the most dynamic processor technology in the industry and enable the adaptable, intelligent and connected world of the future in a multitude of markets including Data Center (Compute, Storage and Networking); Wireless/5G and Wired Communications; Automotive/ADAS; Emulation & Prototyping; Aerospace & Defense; Industrial Scientific & Medical, and others. Xilinx's core strengths simultaneously address major industry trends including the explosion of data, heterogeneous computing after Moore's Law, and the dawn of artificial intelligence (AI).

Our global team is growing and we are looking for bold, collaborative and creative people to help us lead the industry transformation to build an adaptable intelligent world. We believe that by embracing diverse ideas, striving for excellence in all that we do, and working together as a unified team, we can accomplish anything. Come do your best work and live your best life as part of the ONEXILINX team!


Manufacturing Quality and Reliability Engineering and Management
  • Works collaboratively with suppliers to verify changes to design rules, manufacturing processes and materials do not impact quality and reliability
  • Works collaboratively with supplier and/or internal teams to execute reliability evaluation tests and pre-quals to ensure 1st trials pass qualification
  • Ability to execute activities in MRB process
  • Analyzes data and publishes data in standardized format, raises flags on out of control items
Manufacturing Spec and System Management
  • Works collaboratively with suppliers to collect the necessary data in a standardized format
  • Works collaboratively with suppliers to update MFC, CPD, FMEA and MSC for all assembly & substrate approved suppliers
Manufacturing Value Engineering and Supplier Relationship Management
  • Executes different value engineering projects
  • Manages agreed upon meetings with suppliers and develops appropriate agendas
  • Effectively communicates with suppliers on tracking issues; publishes meeting minutes and captures open actions after meetings
  • Works collaboratively with suppliers to understand impact of PCN on Xilinx devices
  • Participates in discussions with suppliers to gain alignment on Xilinx's goals (yield, quality and reliability)
Manufacturing Yield Engineering and Management
  • Maintains a working knowledge of specific interconnect domains
  • Works collaboratively with suppliers to verify changes to design rules, manufacturing processes and materials does not negatively impact yields
  • Collects and stores yield, quality metrics and indices data in agreed upon frequency and database; analyzes data and publishes data in standardized format
  • Raises flags on low yield and/or out of control lots
  • Executes continuous improvement activities and documents results appropriately

Education Requirements
Bachelor Degree or above in Mechanical/Material/

Electronics Engineering.

Years of Experience
Preferred 3+ years of experience in substrate manufacturing. 
• Knowledgeable in substrate materials, substrate manufacturing

process and equipment engineering to manufacture wire bond and

flip chip BGA package.

• Knowledgeable in mechanical and electrical analysis tools and

methodology to characterize substrate materials.

Minimum knowledge on CSAM, X-RAY, XPS, FTIR, SEM/EDX,

TEM, TGA, DMA, TMA and other new analysis techniques.
• Working knowledge on both wire bond and flip chip packaging

and interconnect technologies, package quality and reliability test

and requirements.
• Experience in driving value engineering and continuous improvement

activities with suppliers
• Decision making skills using data analytical tools and techniques.
• Proven capability to collaborate with cross-functional teams,

including package development group, quality systems, planning

and product engineering to provide a comprehensive assessment

of changes from technical, operational and strategic perspective.
• Proven capability to work, interface and communicate with a wide

variety of people and across multiple functional groups in an effective

manner to achieve Xilinx OPX.

Refer to the Talent Network

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