Xilinx develops highly flexible and adaptive processing platforms that enable rapid innovation across a variety of technologies - from the endpoint to the edge to the cloud. Xilinx is the inventor of the FPGA, hardware programmable SoCs and the ACAP (Adaptive Compute Acceleration Platform), designed to deliver the most dynamic processor technology in the industry and enable the adaptable, intelligent and connected world of the future in a multitude of markets including Data Center (Compute, Storage and Networking); Wireless/5G and Wired Communications; Automotive/ADAS; Emulation & Prototyping; Aerospace & Defense; Industrial Scientific & Medical, and others. Xilinx's core strengths simultaneously address major industry trends including the explosion of data, heterogeneous computing after Moore's Law, and the dawn of artificial intelligence (AI).
Our global team is growing and we are looking for bold, collaborative and creative people to help us lead the industry transformation to build an adaptable intelligent world. We believe that by embracing diverse ideas, striving for excellence in all that we do, and working together as a unified team, we can accomplish anything. Come do your best work and live your best life as part of the ONEXILINX team!
We are looking for a talented, self-driven and motivated packaging engineer to be part of a technology development team in Xilinx. This team develops leading edge silicon and packaging technologies used in our products and its team members have ample opportunities to grow their technical knowledge and complex problem-solving skills.
In this position, the engineer will primarily support Packaging Development for various Flip Chip, 3D/SIP/TSV packages including existing and advanced generations. The candidate will be responsible for creating package kits including design and drawing of substrate, heatsink, PCB, along with logistics of purchase request, supplier management, etc. The candidate will also interface with Assembly, Component and PCB suppliers as well as stakeholders from Silicon, Package Development, Design and Process/NPI groups to bring performance, mechanical design kits and cost effective quality solutions for current and advanced Silicon node packages.
A sound knowledge of materials, process development techniques, tolerances is required. Expertise in mechanical design tools such as solidworks, autodesk, autocad, Cadence’s Allegro, etc. is a must. Relevant competencies include Technology assessment and development for Design Requirements, Mechanical Design Enablement and Design Implementation.