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Senior Package Assembly Engineer 2

155757
San Jose, CA, United States
Sep 7, 2018

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Job Description

Description

Xilinx develops highly flexible and adaptive processing platforms that enable rapid innovation across a variety of technologies - from the endpoint to the edge to the cloud. Xilinx is the inventor of the FPGA, hardware programmable SoCs and the ACAP (Adaptive Compute Acceleration Platform), designed to deliver the most dynamic processor technology in the industry and enable the adaptable, intelligent and connected world of the future in a multitude of markets including Data Center (Compute, Storage and Networking); Wireless/5G and Wired Communications; Automotive/ADAS; Emulation & Prototyping; Aerospace & Defense; Industrial Scientific & Medical, and others. Xilinx's core strengths simultaneously address major industry trends including the explosion of data, heterogeneous computing after Moore's Law, and the dawn of artificial intelligence (AI).

Our global team is growing and we are looking for bold, collaborative and creative people to help us lead the industry transformation to build an adaptable intelligent world. We believe that by embracing diverse ideas, striving for excellence in all that we do, and working together as a unified team, we can accomplish anything. Come do your best work and live your best life as part of the ONEXILINX team!

 

We are looking for a Senior Packaging Engineer 2 in our Assembly Engineering team to work on manufacturing development of advance 3D semiconductor packages. In this role, you will be driving board level reliability characterization of monolithic and stacked silicon inter-connect package (SSIT) package technologies. You will also lead value engineering projects for RoHS package BOM conversion and development of military grade XQ flows to meet component level requirements.

 

 

 

 

 

Responsibilities include:

  • Drive the board level reliability characterization program including daisy chain package and PCB design.
  • Working with suppliers on the component surface mounting, second level temperature cycling, shock, and bend testing.
  • Lead the implementation of the RoHS program including package materials development (BOM) for existing product to meet the RoHS reliability requirements
  • Value engineering support for packaging of Xilinx military grade XQ products including customer programs.

Qualifications:

 

  • BS/MS with 2+ years of work experience or PhD
  • MS or PhD degree in the areas of materials, mechanical, industrial engineering or equivalent preferred
  • Must have basic understanding of process development and quality control techniques including DOE, SPC, and FMEA
  • Excellent communication skills with ability to explain and present key packaging concepts
  • Knowledge of JEDEC methodology for component level and board level reliability qualification requirements
  • Familiarity with package mechanical modeling for reliability and design of large outline SIP substrate

 

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